Zhuomao BGA rework station is one of the best BGA rework station suppliers in China. First of all, what is BGA machine? BGA rework/repair station is what we called ball grid array rework station, also abbreviated as BGArs. BGA is a chip packaging technology, which is applied to improve the performance of digital products and reduce the volume of products through the ball grid array structure. All digital products through this BGA machine technology will have common characteristics, that is, small volume, strong performance, low cost, and powerful function. BGA rework machine is the exact equipment used to repair BGA chips. According to the operation requirements, we have launched different BGA rework machines that enjoy a good reputation from our clients all over the world recently.
Now, we are providing the best ball grid array rework station including manual, semi-automatic, and fully automatic BGA repair station and workstation for PCBA repairing; microfocus BGA X-Ray inspection machines, such as offline X-Ray inspection machine, online X-Ray inspection machine, 3D/CT X-Ray inspection machine; Online& offline SMD X-Ray reel counter and SMD smart storage systems, such as smart storage rack, smart storage tower, and smart storage warehouse. This diversified BGA machine for motherboard ranges with reasonable price and technical support enables us to help more and more EMS companies could use higher-level automation production equipment.
As one of the professional BGA Rework Station manufacturers from China, Zhuomao promises to provide the best BGA rework equipment to our customers. We have various BGA pcb rework stations for sale with good quality. If you want to get the BGA rework station machine price list or have any other questions, please contact us as soon as possible.
Types of BGA Rework Station For Sale
ZM-R8650C Fully Automatic BGA Rework Station
R8650C is a fully automatic visual alignment BGA rework station, suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding.
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ZM-R7220A Infrared Soldering Station
ZM-R7220A is an intelligent IR BGA Rework Station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling.
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ZM-R750(PC) Optical Alignment Automatic Rework Equipment
Quipped with a feeder as standard to realize automatic feeding, automatic receivingfor small components, adding quick optical centering function, so that the suctionnozzle can quickly align the compon...
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ZM-R730A Large Board BGA Rework Station
HD Optical Alignment and Intelligent ControlEquipped with automatic feeding device, using Panasonic PLC and high-precision temperature control module, high-precision K-type thermocouple, dynamic PID
ZM-R7830A Smart Optical BGA Rework Station
R7830A is an optical alignment automatic rework equipment, which also works as a laser SMD rework station.
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ZM-R7850A Smart Optical BGA Rework Station
R7850A is an optical alignment automatic rework equipment, equipped with multi-functional control features, convenient temperature setting and storage, bottom heating system, etc.
ZM-R9100 Super Large Board Disassembly Preheating Platform
R9000 super large preheating platform is suitable for the rework of surface mounting devices for 5G and other large servers.
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ZM-ASE2500L Fully Automatic Online De-soldering & Solder Ball Placement Station
This equipment is suitable for the repair of defective semiconductor chip packaging processes. It utilizes a single-point solder ball placement laser welding system, with human-machine control and an ...
ZM-R7880 Integrated BGA Rework Station for Desoldering and Solder Removal
ZM-R7880 is an integrated BGA rework system combining desoldering, component removal, and soldering functions, enabling more convenient and intelligent rework operations.The system is equipped with a ...
ZQ3500 Automated BGA De-soldering & Reballing Rework Line
The system provides fully automatic de-soldering and reballing capabilities and is compatible with multiple package sizes and solder ball diameters (0.3–0.76 mm).The complete system integrates BGA re...
ZM-R5860 Hot Air BGA Rework Station
ZM-R5860 Hot Air BGA Rework Station is a kind of rework station provided by Zhuomao, which has many features and special functions.
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ZM-R720A LED/Micro Component Rework Station
ZM-R720A micro/mini BGA rework station is a precision optical intelligent BGA rework station suitable for the rework of precision micro devices.
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ZM 8000 B Large Precision Rework Station
R8000B is a large-scale precision rework station, self-tuning temperature curve, large-area preheating platform, automatic feeding and adsorption, high-performance, multi-loop heating system.
What is BGA Rework Station Machine？
The BGA rework station, as the name suggests, is a machine used to rework BGA. BGA is a sealed chip. If there is a bad BGA on the production line, this machine needs to be used for rework. The BGA repair station for mobile adopts an integrated design of BGA device removal, placement, alignment, and soldering. It is suitable for the repair of BGA, CSP, POP, PTH, WLESP, QFN, CHIP0201/01005, shielding frames, modules, and other components on PCBA substrates such as servers, PC motherboards, tablet computers, and smart terminals.
How does a BGA Rework Station work?
The working principle of the BGA soldering station is to use artificial intelligence (AI) technology to set a good temperature curve, and through the temperature control system, to achieve high-precision inspection and monitoring of the process of disassembly, soldering, and assembly of the BGA chip rework. The high-end SMD BGA rework system has a visual high-definition automatic alignment function. After the PCB board and BGA, images are captured and positioned by the CCD, the image processing software analyzes and automatically corrects the deviation to achieve precise alignment and placement. The repeat placement accuracy can reach ± 0.01mm. The upper heating device and the placement head realize fully automatic identification of the placement device and placement height and have the functions of fully automatic alignment, fully automatic mounting, fully automatic soldering, and fully automatic desoldering. After knowing the working principle of the BGA rework equipment, you may want to bulk buy the perfect BGA SMD rework station for your electronic equipment repairing. If you want to purchase at a reasonable infrared soldering station price, please contact Seamark ZM first.
Why Choose Seamark ZM As Your BGA Rework Partner?
With over 20 years of dedicated R&D in the SMT repair industry, Seamark ZM (Zhuomao) has become a global leader in high-end PCBA rework technology. Our systems are engineered to meet the rigorous demands of modern electronics:
Precision Alignment: Integrated high-definition optical alignment systems ensure a repeat placement accuracy of ±0.01mm.
Advanced Thermal Control: Utilizing PID closed-loop temperature control and multi-zone heating, our stations prevent thermal shock and board warping.
High Success Rate: Engineered for complexity, our equipment ensures a 99.9% rework success rate for advanced components like 5G server chips, GPUs, and Micro BGA.
Certified Quality: All BGA machines are CE and ISO certified, trusted by Tier-1 EMS companies and global repair centers.
Technical Tips For Successful BGA Rework
To ensure the reliability of your PCBA repair and prevent damage to sensitive components, our engineering team has summarized two critical factors for professional BGA soldering.
1. How to Set the Perfect BGA Rework Temperature Profile?
Setting an accurate temperature curve is the "soul" of BGA rework. A standard lead-free soldering profile typically consists of four stages:
Preheating Stage: Gradually increase the board temperature to 150°C to remove moisture and prevent PCB warping.
Soaking Stage: Maintain between 150°C - 180°C to activate the flux and balance the thermal difference across the board.
Reflow Stage: The peak temperature should be controlled between 230°C - 250°C (for Lead-free) to ensure full melting of solder balls.
Cooling Stage: Rapid but controlled cooling to form a fine-grained solder joint structure.
Deep Dive: For a step-by-step guide on thermal management, please read our professional guide: Temperature Curve Setting Method for BGA Rework Station.
2. Selecting the Right BGA Nozzle
The suction nozzle (hot air nozzle) must match the size of your BGA chip to ensure uniform airflow and prevent "popcorn effects" on surrounding components.
Size Matching: The nozzle should be 2-5mm larger than the BGA chip.
Material Quality: Seamark ZM nozzles are made of high-grade titanium alloy, ensuring they never deform or rust under high temperatures.
Custom Solutions: We provide over 100 types of nozzles for BGA, CSP, QFN, and even customized shapes for specialized shield cans.
We can also offer kinds of pcb x ray inspection machine for sale. If you are interested, please contact us.
If you want to know more kinds of laser reballing machine, please visit our website.
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