Copper Polishing Slurry
According to the characteristics of copper material and high requirements of the 3C fabricate, Kona nano alumina water-based polishing slurry provides a good surface finish with no compromise on the polishing rate.
DISPLAY OF COPPER POLISHING SLURRY
Copper Polishing Slurry
Copper Polishing Slurry
Copper Polishing Slurry
Copper Polishing Slurry
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POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE AND COPPER COMPUTER AND MOBILE PHONE ACCESSORIES
According to the active characteristic of copper material and high requirements of the 3C fabricate, it is a challenge to obtain mirror-like surface finish with no compromise on polishing rate.
Polishing Slurry for 3C Copper Accessories
1
Copper is a soft metal (Mohs hardness 3), and it is a highly reactive metal and it oxidized very easily. That increases the difficulty of polishing Copper Accessories for computer and mobile phone.
2
Our copper cmp slurry is designed for the 3C Copper Accessories polishing process (which is mostly a CMP process ), it is a water-based nano alumina polishing slurry added an additive special for the characteristic of copper.
3
Kona Copper Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate, and also can achieve a good gloss value, such as hundreds gu.
DETAILS OF COPPER POLISHING SLURRY
Copper has good electrical conductivity, thermal conductivity and corrosion resistance, low hardness, strong ductility and good gloss, and is widely used in 3C industry, especially in various mobile phone accessories.
Copper polishing has not only the requirements of flatness and roughness, but also the requirements of glossiness.
Kona provide both nano alumina based and silica colloidal based polishing cu cmp slurry for copper accessories.
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