With support for S5 Sound Platform and S3 Sound Platform - Snapdragon Sound technology, US-based chipmaker Qualcomm has announced two new feature-packed, ultra-low-power wireless audio platforms.
These enhanced operating systems are combining traditional Bluetooth wireless audio and the latest LE audio technology standard.
"In these small platforms, we integrate our adaptive active noise cancellation into a dedicated hardware block, and as a result bring significant noise cancellation improvements to the listener's earphones," said James Chapman, vice president and general manager, voice. Music and wearable products, Qualcomm Technologies, said in a statement.
Audio OEMs offer a wide range of flexibility for device customization across different layers, opening up new platforms and new design possibilities.
Compared to our previous generation wireless audio platforms, a wide range of user experiences are supported by an advanced platform architecture that achieves double the computing capability without compromising on ultra-low-power performance.
The Qualcomm S5 and S3 sound platforms are modeled on customers with business products expected in the second half of the 20th.
Dual-mode, low power optimal integration of LE audio for audio sharing and transmission
Multipoint Bluetooth wireless connection for almost seamless and convenient transitions between source devices
Our third generation Adaptive Active Noise Cancellation, with natural league-through capability
Compared to our previous generation wireless audio platforms, a wide range of user experiences are supported by architecture that achieves twice as much computing capability without compromising on ultra-low-power performance.
Audio OEMs offer a wide range of flexibility for device customization across different layers, opening up new platforms and new design possibilities.
Compared to our previous generation wireless audio platforms, a wide range of user experiences are supported by architecture that achieves double the computing capability without compromising on ultra-low-power performance.
The Qualcomm S5 and S3 sound platforms are modeled on customers with business products expected in the second half of the 20th.
Dual-mode, low power optimal integration of LE audio for audio sharing and transmission
Multipoint Bluetooth wireless connection for almost seamless and convenient transitions between source devices
There are some companies that accurately anticipate the needs of consumers, "said Calm MacDougall, SVP Global Marketing
Kent Cheng, Vice President, In vivo, said, “Snapdragon Sound is a game changer for our mobile devices with excellent audio and connectivity for our customers.” We know that will help. "
“Our customers always expect the latest and best when it comes to their wireless listening experience,” said Lee Zhang, Vice President, Mi Smartphone. "We are pleased to be the first mobile company to bring the new Snapdragon Sound platform to our customers, and continue this journey with Qualcomm Technologies, Inc. to redefine the future of sound."
Compared to our previous generation wireless audio platforms, a wide range of user experiences are supported by architecture that achieves twice as much computing capability without compromising on ultra-low-power performance.
Audio OEMs offer a wide range of flexibility for device customization across different layers, opening up new platforms and new design possibilities.
Compared to our previous generation wireless audio platforms, a wide range of user experiences are supported by architecture that achieves double the computing capability without compromising on ultra-low-power performance.
The Qualcomm S5 and S3 sound platforms are modeled on customers with business products expected in the second half of the 20th.
Dual-mode, low power optimal integration of LE audio for audio sharing and transmission
Multipoint Bluetooth wireless connection for almost seamless and convenient transitions between source devices
The Qualcomm S5 and S3 Sound platforms are modeled on customers with business products expected in the second half of 2022.
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