We can prepare single-layer and multi-layer films of various types, including metal films, dielectric films, semiconductor films, heat-resistant alloy films, hard films, corrosion-resistant films, and transparent conductive films. For instance, we are capable of fabricating perovskite hole transport layers, metal electrodes, and transparent conductive ITO film layers.
Different Types of Magnetron sputtering Coating Machines
High Vacuum magnetron sputtering machine JCP200
The equipment has a small volume, fast vacuum acquisition, powerful functions, and low operating costs; PLC touch screen control, easy to operate.
High Vacuum magnetron sputtering machine JCP350
The device is designed with integrated host and control, PLC touch screen control, easy to operate, and can complete single target independent sputtering.
High Vacuum sputtering coating machine JCP500
Composed of vacuum system, vacuum measurement system, gas path system, PLC+touch screen control system, sputtering system, etc.
High Vacuum magnetron sputtering coating machine JCPY500
Used for scientific research and small-scale preparation of thin film new materials, it consists of magnetron sputtering chamber, wafer storage chamber, etc.
How Does the magnetron sputter coater Work?
A Magnetron sputtering coating equipmentoperates by using a strong magnetic field to confine plasma close to the surface of a target material. When a high voltage is applied, ions from the plasma collide with the target, causing atoms to be ejected. These ejected atoms then travel through a vacuum chamber and deposit onto a substrate, forming a thin film. The process allows for precise control over the film's thickness and composition, making it ideal for applications in electronics, optics, and materials science. The use of a magnetic field enhances the efficiency and uniformity of the coating process.
What Thickness Target for Magnetron Sputtering?
When selecting the thickness of a target for magnetron sputtering, several factors must be considered, including the desired film thickness, deposition rate, and target material. Typically, target thickness ranges from 3 to 6 mm for most applications. Thicker targets (up to 10 mm or more) are used for high-power applications or extended sputtering runs to ensure uniform erosion and longevity. It's crucial to balance target thickness with the system’s power capabilities and cooling efficiency to prevent overheating and ensure consistent deposition. Consulting with the target manufacturer and considering the specific requirements of your sputtering system will yield the best results.
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