During the cutting process of the laser cutting equipment, the light beam is focused into a very small focus by the lens of the cutting head, so that the focus reaches a high power density, and the cutting head is fixed on the z-axis. At this time, the heat input by the light beam far exceeds the heat reflected, conducted or diffused by the material, and the material is quickly heated to the melting and vaporization temperature. At the same time, a high-speed airflow blows out the melted and vaporized material from the coaxial or non-coaxial side to form a hole for material cutting. With the relative movement of the focus and the material, the hole forms a continuous narrow slit, completing the cutting of the material.
Features of custom laser cutting machine
Laser cutting directly based on CAD data is more convenient and faster, which can greatly shorten the delivery cycle.
The processing difficulty is not increased due to complex shapes and tortuous paths.
The processing of flexible board samples often causes changes in the cover film window due to customer needs to modify the circuit and pad position. The traditional method requires re-replacement or modification of the mold. However, with laser processing, this problem can be easily solved, because you only need to import the modified CAD data to easily and quickly process the cover film with the window pattern you want, which will give you a market competitive advantage in terms of time and cost.
Laser processing has high precision and is an ideal tool for flexible circuit board molding. Laser can process materials into any shape.
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